Surface Modification Using Nano-phase Structures ofEpoxy/block Copolymer Blends for Electroless Copper Plating
نویسندگان
چکیده
منابع مشابه
Polyimide surface modification by using microwave plasma for adhesion enhancement of Cu electroless plating.
Microwave (MW) plasma was applied to the surface of polyimide (PI) films as a treatment to enhance the adhesion between copper deposition layer and PI surface for electroless plating. The influences of nitrogen MW plasma treatment on chemical composition of the PI surface were investigated by using X-Ray photoelectron spectroscopy (XPS). The wettability was also investigated by water contact an...
متن کاملProcess analysis of electroless copper plating for AB5- type hydrogen storage alloy using support vector regression
Surface modification is an effective method to improve the electrochemical property of hydrogen storage alloy. In order to investigate the influence of process factors of electroless copper (Cu) plating for AB5-type hydrogen storage alloy on Cu coating mass, a novel modeling approach, support vector regression (SVR) combined with particle swarm optimization (PSO), was proposed to construct a ma...
متن کاملElectroless Nickel Plating with Hypophosphite
In the previous chapter, the components of electroless nickel plating baths were discussed from the viewpoint of the function each performs in the bath, with little attention paid to their effect on the plating process. The metal and the electron source (the reducing agent) are consumed in the electroless plating reaction and so their concentrations in the bath are continuously decreasing. Ther...
متن کاملElectroless Nickel Plating: Bath Control
In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...
متن کاملCopper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films
Copper electroless plating at low pH (7–9) using dimethylamine borane complex as a reducing agent is studied electrochemically by linear sweep voltammetry, cyclic voltammetry and chronopotentiometry in full electrolytes. We find that the mixed potential theory is not applicable to the described system. We show that both the working potential and the rate-controlling mechanism are dependent on t...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of The Adhesion Society of Japan
سال: 2015
ISSN: 0916-4812,2187-4816
DOI: 10.11618/adhesion.51.237